Mattson Technology is the productivity and technology leader
in the plasma dry strip market. Our strip systems offer the
widest process range and feature our patented inductively
coupled plasma (ICP) technology. Mattson’s system architecture
and strip technology provides the lowest contamination levels
at the highest throughput. Complete residue removal is accomplished
in one chamber in situ, eliminating the need for organic solvents,
thereby reducing process costs and alleviating environmental
concerns. Mattson’s strip systems offer our customers
the lowest total cost of ownership (TCO) by providing the
high yield, fast throughput, reduced process steps and low
operating cost.
Fabrication of integrated circuits with feature sizes under
90 nanometer requires advanced dry strip technologies such
as our Suprema and Alpine Strip systems. In addition, faster
IC devices require the use of advanced materials, such as
low and ultra-low capacitance, or Low-k/ULK dielectrics, copper,
metal gates, and silicides. The use of these new materials
creates new challenges for photoresist stripping equipment.
The resist or residues must be removed from these materials
without degrading critical performance characteristics and
device yield. At 32nm and below, critical ultra-shallow junctions
(USJ) require cleaning processes that meet 0.3 angstroms of
silicon loss per clean step according to ITRS (International
Technology Roadmap for Semiconductors) specifications. Combined
with the use of ULK at k values below 2.5, removing residues
and preserving capacitance values requires the most advanced
hardware and process capabilities.
Our strip systems enable both high productivity and advanced
process development on a single product offering. We provide
leading process results on a wide range of dry strip applications,
including:
Strip and Residue Removal
High Dose Implant Strip (HDIS)
Bulk Resist Strip
Strip Resist over Ultra-Low-K (ULK) Films
Resist Recess Process
Resist “De-scum
Resist Strip over Metal Gates
PLAD
MLR processes
Our dry strip products encompass both 200 and 300 mm products
on our Aspen platform, and our latest generation high productivity
Suprema and Alpine, using our patented, inductively coupled
plasma (ICP) technologies. We have a large, world-wide installed
base of surface cleaning systems at 18 of the top 20 semiconductor
manufacturers in high volume logic, foundry, DRAM and flash
memory production facilities.
|
