The latest addition to Mattson's complete family of dry strip products, the Alpine™ enables chipmakers to handle copper/low-k dielectric integration, low-k/ ultra low-k ashing, resist recess, barrier layer removal and other BEOL dry strip challenges with a single tool, in addition to all critical FEOL dry strip process requirements. With a low-pressure regime, the Alpine provides improved profile control, low-k material preservation and a wider process window. The system builds on Mattson’s latest production proven platform and is designed for reliable, high-productivity, low-cost-of-ownership manufacturing for 65 nm and below.
The Alpine features Mattson's proprietary inductively coupled plasma (ICP) source and a bias capability that enables independent control of ion energy and ion density at low pressures to minimize damage to low-k materials for sub-65 nm processing. The Alpine's unique PR processing for low-k/Cu dual damascene structures for advanced logic devices, provides chipmakers up to 35% lower cost-of-ownership than dielectric etch tools.
Alpine’s innovative proprietary platform is based on a flexible, modular design that makes it ideal for both development and production environments. The system features reliable, high-speed vacuum and atmospheric robotics that deliver increased throughput and over 40% improvement compared to competitive systems for advanced strip applications. Its vacuum robot utilizes an innovative transfer mechanism capable of transferring four wafers simultaneously to minimize overhead time. Alpine is configured with two dual-wafer modules in a compact footprint for the lowest total cost of ownership.
|
