| MATTSON TECHNOLOGY TEAMS WITH CFM TECHNOLOGIES
TO PROVIDE ADVANCED WET/DRY CLEANING SOLUTIONS FOR SEMICONDUCTOR PROCESSING
FREMONT, Calif. — June 24, 1999 — Mattson Technology
(NASDAQ: MTSN) and CFM Technologies (NASDAQ:CFMT) today announced
that they are working together to further develop and market
total cleaning solutions for selected semiconductor processing
applications using dry and wet wafer cleaning systems.
Brad Mattson, Mattson Technology’s CEO, said, "We
are focusing on total cleaning solutions as a major growth
opportunity for Mattson’s Aspen Strip products. As
the industry moves ahead with linewidth shrinks and later
into 300mm manufacturing, it will be more important than
ever to provide strip technology that achieves the clean,
contamination free results required in this arena."
Mattson and CFM will initially focus on optimizing wafer
cleaning for post implant resist removal with dry and wet
cleaning. Resist implanted at high dose levels is very difficult
to clean. All customers use a combination of dry plasma cleaning
and wet chemical cleaning. Mattson and CFM are seeking to
optimize equipment throughput and chemical usage, while achieving
the cleanest possible wafers.
Roger Carolin, CEO of CFM Technologies, said, "We are
extremely pleased to be working closely with Mattson Technology
on total clean solutions. With the rising cost of equipping
a fab, it’s good to be working on a solution that can
meet advanced technology requirements and still take care
of cost issues – a growing concern among all semiconductor
makers."
Results stemming from the joint work will be presented at
a cleaning symposium to be held on Thursday July 15, 1999
at the Mark Hopkins Inter-Continental Hotel in San Francisco.
The event, cosponsored by CFM Technologies, will also feature
invited speakers from leading edge semiconductor companies,
Infineon Technologies, IBM, IMEC, AMD and STMicroelectronics.
Symposium topics on advanced wafer cleaning will cover a
variety of leading edge applications, ranging from post ash
clean, cleaning vias with exposed low k dielectrics (FOX),
cleaning next-generation low k materials, removing post-metal
and pad etch residue, eliminating solvent for post metal
etch residue removal, to optimized cleaning for high dose
implant strip. Other projects will include publishing joint
papers and additional experimental work that focuses on total
clean solutions using dry/wet systems.
About Mattson Technology
Mattson Technology Inc., is a leading supplier of thermal,
plasma and wet semiconductor processing equipment. The company's
products combine advanced process technology on a high productivity
platform, backed by industry-leading support. Since beginning
operations in 1989, the company's core vision has been to
help bring technology leadership and productivity gains to
semiconductor manufacturers worldwide. Headquartered in Fremont,
Calif., the company maintains sales and support centers throughout
the United States, Europe, Asia/Pacific and Japan. For more
information, please contact Mattson Technology Inc., 2800
Bayview Drive, Fremont, Calif. 94538. Telephone: (800) MATTSON.
Fax: (510) 657-0165. Internet:www.mattson.com
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