| MATTSON ANNOUNCES BREAKTHROUGH STRIP CAPABILITY FOR LOW-K AND COPPER MANUFACTURING
New Aspen Strip System Enables Advanced Semiconductor Processing
FREMONT, Calif. — May 21, 1999 — Mattson Technology,
Inc. today announced a new strip capability for the ICP series
of Aspen Strip systems for use in advanced processing of
low k materials and copper metallization interconnects used
for high-speed integrated circuits. The announcement follows
the receipt of two multimillion dollar follow-on orders for
multiple Aspen Strip systems with this capability from one
of North America's largest manufacturers of logic devices.
After a lengthy on-site evaluation, the customer placed multiple
orders with shipments in Q2 and Q3 1999.
The new strip capability provides advanced processing recipes
that enable interconnect technology for 0.18um and smaller
geometries using a wide range of hydrogen and fluorine chemistries.
This Aspen Strip feature enables manufacturers to clean vias
or trenches with exposed low k materials while maintaining
low k film integrity. In addition, it enables effective cleaning
of copper films. The Aspen Strip platform has a unique loadlock
design that allows for safe hydrogen processing without cycle
purging and includes special gas handling and safety features.
The strip feature can be ordered as an option with ICP and/or
ICPSM chambers. Aspen Strip ICP systems achieve competitive
throughput that exceeds 120 wafers per hour, and can be used
for cleaning on copper metallization and dielectric layers
utilizing low k materials. Mattson's field-proven ICP technology
was introduced in 1997 to further extend the capability for
removal of the most difficult residues formed during semiconductor
processing.
Mattson has several programs in place to refine processes
for 0.18 µm and below with other leading semiconductor
researchers and manufacturers, such as IMEC, one of the world’s
foremost R&D centers for advanced submicron semiconductor
processing, and SEMICONDUCTOR300, a joint development venture
between Siemens and Motorola that recently announced production
of the world’s first 300mm semiconductor wafers.
"Design shrinks have become critical to our customers," commented
Brad Mattson, CEO of Mattson Technology. "The migration
to 0.18 micron design geometries and low k materials is happening
much earlier than anticipated, and we are committed to developing
products that meet the ever-changing needs of our customers."
MATTSON'S INNOVATIVE STRIP TECHNOLOGY
Mattson's Aspen ICPSM source offers manufacturers advanced
low temperature strip capabilities. It's equipped with a
modified Faraday shield for maximum process flexibility,
allowing the user to select the plasma mode for each step
in the process. The Aspen ICPSM system achieves excellent
results for a variety of applications, including high dose
implant strip, via residue removal, post metal etch residue
removal, and surface cleaning for advanced silicide applications,
as well as cleaning low k trenches or vias. There are more
than 500 Aspen Strip systems in the field.
About Mattson Technology
Mattson Technology Inc., is a leading supplier of thermal,
plasma and wet semiconductor processing equipment. The company's
products combine advanced process technology on a high productivity
platform, backed by industry-leading support. Since beginning
operations in 1989, the company's core vision has been to
help bring technology leadership and productivity gains to
semiconductor manufacturers worldwide. Headquartered in Fremont,
Calif., the company maintains sales and support centers throughout
the United States, Europe, Asia/Pacific and Japan. For more
information, please contact Mattson Technology Inc., 2800
Bayview Drive, Fremont, Calif. 94538. Telephone: (800) MATTSON.
Fax: (510) 657-0165. Internet:www.mattson.com
|
