MATTSON TECHNOLOGY INSTALLS 300 MM CVD SYSTEM AT SAMSUNG World

DRAM Leader to Evaluate the Tool for its 300 mm Pilot Line

FREMONT, Calif. — February 16, 1999 — Mattson Technology (Nasdaq: MTSN) today announced that it has installed a 300 mm Aspen III CVD system at Samsung Electronics' Kihung, Korea facility. The installation represents a significant technology achievement for Mattson Technology as it continues to penetrate key 300 mm pilot lines with its chemical vapor deposition (CVD) equipment. Already the second placement for the 300 mm Aspen III CVD system, Mattson's 300 mm technology is easily scalable to 200 mm, requiring only minor hardware and software modifications.

Today’s announcement follows Mattson’s September 1998 announcement of an Aspen III CVD system installation at SELETE in Japan, a joint venture company established by 10 Japanese device manufacturers studying 300 mm tools. The Samsung installation is also the third overall new product placement that Mattson has disclosed in Asia in the past four months. In November 1998, Hitachi-Nippon Steel placed an order for multiple Aspen RTP systems for its facility in Singapore, serviced by Mattson's recently established subsidiary, Mattson International Singapore Pte. Ltd.

The Aspen III CVD system deposits silane-based films- silicon-oxynitride and silicon-nitride - and TEOS (tetraethylorthosilicate) oxide. Mattson offers a full suite of CVD applications for passivation; IMD underlayers, low temperature capping layers, FSG, spacers; PMD; TEOS hard mask using low temperature deposition; SiC deposition for etch stop and passivation; and SiO2 backseal. The Aspen III CVD has the capability to process up to 180 wafers per hour, depending on the type of film deposited.

"There is a growing interest among DRAM manufacturers in maximizing profitability," said Brad Mattson, CEO of Mattson Technology. "To maximize the value of the 300 mm investment, semiconductor companies look to Mattson CVD systems, which have a throughput 50 percent greater than that of our nearest competitor."

ABOUT THE ASPEN III CVD SYSTEM

The Aspen III CVD system is a fully automated plasma-enhanced chemical vapor deposition (PE CVD) system used for depositing silane-based and TEOS films on either 200 mm or 300 mm wafers for a variety of leading edge process applications. The system accommodates 200mm wafers with minor modifications to the platform or the process module. The flexible system design addresses the needs of large volume manufacturing where cost is a major consideration, such as DRAM, as well as small volume production of ASIC and logic devices. By providing 50% throughput advantage and the smallest footprint available in 200 and 300 mm PECVD tools, the Aspen III CVD significantly reduces costs, especially for customers that use multiple thin layers in their BEOL (Back End of Line) process. The Aspen III CVD system debuted at SEMICON/West 98.

About Mattson Technology

Mattson Technology Inc., is a leading supplier of thermal, plasma and wet semiconductor processing equipment. The company's products combine advanced process technology on a high productivity platform, backed by industry-leading support. Since beginning operations in 1989, the company's core vision has been to help bring technology leadership and productivity gains to semiconductor manufacturers worldwide. Headquartered in Fremont, Calif., the company maintains sales and support centers throughout the United States, Europe, Asia/Pacific and Japan. For more information, please contact Mattson Technology Inc., 2800 Bayview Drive, Fremont, Calif. 94538. Telephone: (800) MATTSON. Fax: (510) 657-0165. Internet:www.mattson.com