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Press Releases - 2007

LEADING JAPANESE MEMORY MANUFACTURER SELECTS MATTSON TECHNOLOGY'S STRIP AND RTP TOOLS FOR VOLUME 65 NM PRODUCTION AND SUB-45 NM DEVICE DEVELOPMENT IN NEW FAB

Suprema™ Strip and Helios™ RTP Systems Orders Support Advanced NAND Flash Production

FREMONT, Calif. - December 5, 2007 - Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that a leading Japanese memory manufacturer has placed follow-on orders for its Suprema™ strip and Helios™ RTP systems for volume production of 65 nm NAND flash chips in the chipmaker's newest 300 mm fab. The chipmaker will also use Suprema for the development of advanced chips down through 32 nm. System shipments have already begun, expanding the chipmaker's installed base of Mattson equipment.

The NAND flash memory market is growing quickly on healthy growth in a wide range of digital electronic applications, including MP3 music players, mobile phones and several kinds of memory cards.

“Our customer has again selected Mattson's Suprema and Helios systems as a result of our tools' high productivity, superior process performance and low cost-of-ownership," said Stephen T. Lanza, senior vice president and general manager of Mattson Technology's Global Business Operations. "This chipmaker currently has the largest installed base of Supremas and chose the system for advanced 45 and 32 nm device development—including for advanced HDIS applications—demonstrating its confidence in the system's ability to deliver the process extendibility that can help speed time to market for the company's future products. Our Helios RTP system is in high-volume production at this chipmaker's fab after successfully demonstrating productivity benefits over the competition's tool for NAND flash manufacturing. We look forward to supporting our customer as it expands production capacity for its latest state-of-the-art 300 mm fab and a s it migrates to finer geometries to produce next-generation chips to meet anticipated demand for NAND flash memory products in 2008 and beyond."

Suprema combines Mattson's proprietary inductively coupled plasma (ICP) technology with an innovative handling architecture designed to provide the greatest productivity per square meter of fab space, the lowest cost-of-ownership (COO), the industry's highest throughput and best defect performance for bulk strip applications, as well as the maximum process performance for high-dose implant strip (HDIS), descum and resist recess processes.

The Helios, which features an advanced model-based temperature control, addresses the most demanding RTP applications, delivering high productivity, excellent processing performance and superior COO.

About Mattson Technology, Inc.
Mattson Technology, Inc. is the leading supplier of dry strip equipment and the second largest supplier of rapid thermal processing equipment in the global semiconductor industry. The company's strip and RTP equipment utilize innovative technology to deliver advanced processing performance and productivity gains to semiconductor manufacturers worldwide for the fabrication of current- and next-generation devices. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900. Fax: (510) 492-5911. Internet: www.mattson.com.


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