MATTSON TECHNOLOGY WINS FOLLOW-ON STRIP AND RTP ORDERS FROM MAJOR TAIWANESE CHIPMAKER FOR PHASE II 300 MM FAB EXPANSION

Aspen III ICPHT Strip and Helios RTP Systems Selected for 110 nm DRAM Device Manufacturing

FREMONT, Calif.- November 10, 2004 - Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that it has won multi-million dollar follow-on orders for its strip and RTP tools from a major Taiwanese DRAM manufacturer. This chipmaker chose multiple Helios RTP systems and the Aspen III ICPHT system for 100% of its strip requirements for phase II of its 300 mm fab expansion. The systems have begun shipping to the customer’s fab in Taiwan, where they will support advanced 110 nm and below memory device production.

“Key requirements for ramping a new fab include rapid time to qualification and cost-effective manufacturing,” said Robert B. MacKnight, chief operating officer of Mattson Technology. “Our 300 mm Aspen III ICPHT strip and Helios RTP systems were chosen by this major Taiwanese chipmaker to support its fab expansion for their advanced technology, reliable processing capabilities and excellent cost of ownership. We look forward to supporting our customer to accelerate the manufacturing of its latest generation DRAM chips.”

About the Aspen III ICPHT

Built upon the production-proven Aspen III platform, Mattson Technology’s new Aspen III ICPHT utilizes an enhanced RF plasma source with Mattson’s proprietary inductively coupled plasma (ICP) technology to provide a wider process window for FEOL and BEOL strip applications. Featuring high-speed, dual-wafer handling and a modular design, the system provides the excellent process performance, increased throughput, high reliability and low CoO required for cost-effective chip manufacturing.

About the Helios RTP System

Mattson Technology’s new Helios 300 mm RTP system features an advanced model-based temperature control approach for excellent uniformity, fast ramp and cool-down rates and closed-loop control down to 250°C. The Helios is built on a modular, dual-chamber platform designed for ease of maintenance, high reliability and throughput of over 120 wafers per hour. The system’s high productivity and small footprint offer cost-of-ownership advantages, and its processing performance addresses the most demanding RTP applications, including nickel silicide formation and ultra-shallow junction spike anneals.

About Mattson Technology, Inc.

Mattson Technology, Inc. is a leading supplier of semiconductor wafer processing equipment used in the fabrication of integrated circuits. The company’s dry strip and RTP equipment utilize innovative technology to deliver advanced processing capabilities on high-productivity platforms for the fabrication of current- and next-generation devices. Since beginning operations in 1989, the company’s core vision has been to help bring technology leadership and productivity gains to semiconductor manufacturers worldwide. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900. Fax: (510) 492-5911. Internet: www.mattson.com.