MAJOR ASIAN FOUNDRY SELECTS MATTSON TECHNOLOGY FOR FEOL AND BEOL STRIP PROCESSING IN NEW 300 MM FAB

Aspen III ICPHT Systems Support 300 mm Production Ramp

FREMONT, Calif.- July 13, 2004 - Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that one of the world’s top three dedicated semiconductor foundries has selected its new Aspen III ICPHT strip systems to manufacture 130 nanometer (nm) and 90 nm logic and communications devices. The systems, the first Aspen III ICPHT tools ordered by the customer, have been recently installed in its 300 mm fab in Singapore and will be used for both front-end-of-line (FEOL) and back-end-of-line (BEOL) strip processing. The multi-system sale further expands Mattson’s installed base at this major foundry and in the Asia-Pacific region.

“This customer, one of the next 300 mm adopters, chose our Aspen III ICPHT strip systems because they demonstrated the best overall system performance, productivity and cost of ownership,” said
Randy Matsuda, vice president and general manager of the Films/Etch Products Group for Mattson Technology. “The systems’ advanced technology capabilities and extendibility through several generations will be important in helping our customer to maximize manufacturing productivity and accelerate production ramp at its new 300 mm fab.”

“We are pleased to collaborate with this leading foundry on the expansion of its new fab, where Mattson is the sole strip supplier,” said Dr. Bruno Doetsch, senior director and general manager of Asian operations of Mattson Technology. “Mattson’s dedicated and comprehensive global service was a key factor in this new order win, and we remain committed to delivering the best-of-breed technologies necessary to support our long-time foundry customer’s aggressive 300 mm production ramps.”

About the Aspen III ICPHT

Built upon the production-proven Aspen platform, Mattson Technology’s new Aspen III ICPHT utilizes an advanced RF plasma source and Mattson’s proprietary inductively coupled plasma (ICP) technology to provide a wider process window for FEOL and BEOL strip applications. Featuring high-speed dual-wafer handling and a modular, dual-chamber design, the system provides excellent within-chamber and module-to-module repeatability. Enhanced features include an upgraded RF assembly and a redesigned heater block for increased strip rates, throughput, performance (throughput and process time improvements of 100% have been demonstrated for HDIS) and reliability. The ICPHT’s high productivity and excellent process performance provide the low CoO required for cost-effective chip manufacturing.

About Mattson Technology, Inc.

Mattson Technology, Inc. is a leading supplier of semiconductor wafer processing equipment used in the fabrication of integrated circuits. The company’s dry strip and RTP equipment utilize innovative technology to deliver advanced processing capabilities on high-productivity platforms for the fabrication of current- and next-generation devices. Since beginning operations in 1989, the company’s core vision has been to help bring technology leadership and productivity gains to semiconductor manufacturers worldwide. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900. Fax: (510) 492-5911. Internet: www.mattson.com.