MATTSON TECHNOLOGY EXTENDS STRIP PRODUCTIVITY WITH NEW STRIP SYSTEM

Aspen III ICPHT Delivers Exceptional Throughput and CoO for High-Volume Resist Strip Applications

FREMONT, Calif. — April 19, 2004 — Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today introduced its new Aspen III ICPHT dry strip system. This new system provides chipmakers a significant productivity improvement for all strip applications in high-volume manufacturing of DRAM, logic and flash memory devices.

The ICPHT builds upon Mattson’s field-proven Aspen platform, over 900 of which are installed in customer fabs worldwide, and offers uniform and repeatable processing while providing a wider process window and compatibility with a variety of chemistries to handle dry strip and residue removal applications. Utilizing an advanced RF plasma source, based on Mattson’s proprietary inductively coupled plasma (ICP) technology, the ICPHT provides significant improvements in process time and throughput. Throughput improvements of 100% have been demonstrated for high-dose implant strip (HDIS), which is generally known as one the most difficult strip applications. Enhanced features include an upgraded RF assembly and a redesigned heater block for increased throughput and improved process performance and reliability. The new features are also available as an upgrade to existing Aspen III ICP Strip systems.

“Chipmakers continue to demand a reliable, versatile dry strip system that provides higher productivity at lower cost," said Randy Yuya Matsuda, vice president and general manager of Mattson Technology’s Films Etch Product Group. “Our new Aspen III ICPHT strip system combines our successful Aspen platform with enhancements that make it one of the most flexible, efficient and cost-effective photoresist strip systems available today. We will continue our commitment to develop reliable, high-throughput strip tools that provide the lowest total cost of ownership to our customers worldwide.”

According to Gartner Dataquest, an independent market research firm, the dry strip market size for 2003 was $219.1 million and is expected to grow to $327.7 million in 2004. The addition of the ICPHT to Mattson Technology's full line of dry strip product offerings for front-end-of-line (FEOL) and back-end-of-line (BEOL) process applications is expected to strengthen Mattson’s leadership position and enable increased share gains in the dry strip market.

The ICPHT has already been qualified for high-volume chip manufacturing at several key customer sites. Shipments for volume production are expected to begin in the second quarter of 2004.

About the Aspen III ICPHT

Joining Mattson Technology’s complete family of dry strip products, the Aspen III ICPHT has been specifically designed to reduce cost of ownership and improve productivity for high-volume strip applications. The system builds on the production-proven Aspen platform, which has been adopted by chipmakers worldwide for its reliability and productivity. The ICPHT features an advanced RF plasma source, based on Mattson’s proprietary ICP technology, which both widens the process window for advanced applications and increases strip rate and throughput for high productivity. The system meets all critical dry strip process requirements, including photoresist strip and residue removal, HDIS, descum and resist recess applications.

Available in 200 mm and 300 mm versions, the Aspen III ICPHT is based on a flexible, modular design that makes it ideal for both development and production environments. Featuring high-speed dual-wafer handling, the system can be configured with up to two chamber modules that allow simultaneous processing and give customers the flexibility to add incremental capacity. The ICPHT provides excellent repeatability, both within each chamber module and from module to module. The ICPHT’s enhancements provide the low cost of ownership with the high throughput and process performance chipmakers require for cost-effective volume chip manufacturing.

About Mattson Technology, Inc.

Mattson Technology, Inc. is a leading supplier of semiconductor wafer processing equipment used in the fabrication of integrated circuits. The company’s dry strip and RTP equipment utilize innovative technology to deliver advanced processing capabilities on high-productivity platforms for the fabrication of current- and next-generation devices. Since beginning operations in 1989, the company’s core vision has been to help bring technology leadership and productivity gains to semiconductor manufacturers worldwide. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900. Fax: (510) 492-5911. Internet: www.mattson.com.