| MATTSON TECHNOLOGY AND TOKYO ELECTRON LTD ANNOUNCE A STRATEGIC TECHNOLOGY ALLIANCE
TOKYO and FREMONT, Calif. — April
15, 2004 —Tokyo Electron Ltd. (TEL), a global supplier
of semiconductor and flat panel display production equipment,
and Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier
of advanced process equipment used to manufacture semiconductors,
today announced a strategic technology development partnership
and the successful integration of Mattson’s proven
rapid thermal processing (RTP) technology with TEL’s
advanced gate dielectric technology. The collaboration combines
TEL’s successful Trias® SPA Plasma Processing system
with Mattson’s single-wafer, RTP, low-pressure annealing
(LPA) module.
The LPA module, which was designed and developed at Mattson
and combined with TEL’s technology, will produce state-of-the-art
gate dielectrics by combining Mattson’s expertise in
RTP with TEL’s ultra-thin oxide technology and nitridation
by SPA (slot plane antenna). Several modules have been placed
at key customer sites. The LPA module will be manufactured
by Mattson exclusively for TEL and integrated with other
process modules on TEL’s Trias single-wafer platform.
As part of the collaboration, TEL will provide customer support
and Mattson will provide technology support for the system.
“Our joint development work with TEL is an extension
of Mattson Technology's overall strategy to leverage technology
alliances to develop best-of-breed products that deliver
superior results on the wafer for our customers,” said
Robert B. MacKnight, chief operating officer of Mattson Technology. “We
expect Mattson’s and TEL’s combined expertise
in transistor development to enhance our abilities to offer
advanced transistor formation technologies to the industry
and look forward to working with TEL on future collaboration
projects.”
“Our strategic partnership with Mattson Technology
not only provides our SPA tool with a competitive advantage,
but also demonstrates the creativity of both companies when
trying to find solutions to our customers’ unique problems,” said
Clark Takenaka, general manager of TEL’s Single-Wafer
Deposition Business Unit.
The next phase of the joint development partnership is expected
to yield improved processes for high-k dielectrics, ultra-thin
interface layers and plasma oxy-nitride films for gate and
capacitor applications serving both logic and memory markets.
Trias is a registered trademark of TEL in Japan, USA, Korea,
Taiwan, UK, Italy, France and Germany.
About TEL
TEL is a leading supplier of innovative semiconductor and
FPD (flat panel display) production equipment worldwide.
Product lines include coater/developers, thermal processing
systems, dry etchers, CVD systems, wet cleaning systems,
and test systems. In Japan, TEL distributes other leading
edge semiconductor equipment tools, such as metrology tools
or process control systems. In addition, TEL distributes
high quality computer systems, semiconductor devices and
electronic components of other leading suppliers, as well
as computer network related products from around the world.
To support this diverse product base, TEL has strategically
located research & development, manufacturing, sales,
and service locations all over the world. TEL is a publicly
held company listed on the Tokyo Stock Exchange. http://www.tel.com
About
Mattson Technology, Inc.
Mattson Technology, Inc. is a
leading supplier of semiconductor wafer
processing equipment used in the fabrication
of integrated circuits. The company’s
dry strip and RTP equipment utilize innovative
technology to deliver advanced processing
capabilities on high-productivity platforms
for the fabrication of current- and next-generation
devices. Since beginning operations in
1989, the company’s core vision has
been to help bring technology leadership
and productivity gains to semiconductor
manufacturers worldwide. For more information,
please contact Mattson Technology, Inc.,
47131 Bayside Parkway, Fremont, Calif.
94538. Telephone: (800) MATTSON/(510) 657-5900.
Fax: (510) 492-5911. Internet: www.mattson.com.
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