MATTSON TECHNOLOGY SCORES ANOTHER RTP WIN IN TAIWAN

Adds New 300 mm DRAM Customer for Advanced RTP Systems

FREMONT, Calif. — September 10, 2003 — Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that it has added a new customer, a leading DRAM manufacturer in Taiwan, for its advanced 3000 series RTP systems. The systems, which are scheduled to begin shipment by the end of the third quarter 2003, will be used in the chipmaker’s existing 300 mm fab located in Hsin Chu, Taiwan in the production of advanced DRAM devices at the 110 nm technology node.

“This latest order places our RTP tools into a fab line where 100% of the customer’s RTP requirements was previously supplied by a competitor,” said David L. Dutton, president and chief executive officer of Mattson Technology. “The new customer’s selection of Mattson Technology reinforces our superior RTP capabilities and industry-leading low cost of ownership. Our strategic focus on core products of RTP and strip provide us the opportunity to gain market share, and this new Taiwan account win, the second announced in the last three weeks, is indicative of our positive trajectory.”

"Customers continue to rely on Mattson's advanced product portfolio, as well as our strong local and global support capability,” said Bruno Doetsch, senior director of China, Taiwan and Southeast Asian operations of Mattson Technology. “This multiple-system order reinforces the growing global acceptance of our 3000 series RTP tools in addressing the stringent thermal processing challenges associated with the manufacturing of next-generation devices at the sub-130 nm regime. We are pleased to have been selected to provide high-performance, cost-effective RTP tools to our latest new customer in the Asian semiconductor market."

About the 3000 RTP Series

The 3000 series is Mattson Technology's advanced RTP product line. The 3000 series tools leverage Mattson Technology’s unique spike anneal and oxidation process capabilities, in conjunction with the standard suite of RTP applications, to provide chipmakers the superior thermal processing performance needed for their stringent next-generation manufacturing requirements at the 90nm and below technology nodes.

About Mattson Technology, Inc.

Mattson Technology, Inc. is a leading supplier of semiconductor wafer processing equipment used in "front-end" fabrication of integrated circuits. The company is a market leader in dry strip and RTP equipment, and its products combine advanced process technology on high-productivity platforms backed by industry-leading support. Since beginning operations in 1989, the company’s core vision has been to help bring technology leadership and productivity gains to semiconductor manufacturers worldwide. Headquartered in Fremont, Calif., the company maintains sales and support centers throughout the United States, Europe and Asia. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900. Fax: (510) 492-5911. Internet: www.mattson.com.