FREMONT, Calif.- July 22, 2002 - Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that two major Japanese device manufacturers have each successfully developed a production-worthy 90 nanometer (nm) process flow using Mattson's industry-leading 3000 RTP tool. The companies have been using the 3000 RTP system, an advanced 300 mm tool designed for ultra-shallow junction formation, to develop manufacturable solutions for next-generation devices.

Uniformity and low defectivity are two important requirements for the development of advanced 90 nm process technology. During the qualifiation, the Japanese chipmakers found that the 3000's state-of-art process control module enabled highly uniform and repeatable 90nm device formation and that the tool demonstrated excellent reliability and flexibility.

"The 3000 successfully met our customers' process requirements, while providing a high-volume, cost-effective solution," said Bob MacKnight, president of the Thermal, Films and Etch division at MattsonTechnology. "The 3000's design and its superior process control capabilities allow chipmakers to achieve the high uniformity and gain the yield and process margin necessary for the successful development of next-generation production process flows. The successes at the two leading Japanese fabs validate the 3000's ability to address the requirements of sub-0.13 micron design rules and demonstrate its ability to meet the challenges of 90 nm fabrication technology."

About the 3000

The 3000 is Mattson Technology's advanced 300 mm and 200 mm RTP tool designed for high-volume production of devices down to 0.10-micron feature sizes. The 3000's unparalleled temperature control capabilities enable spike anneal processes with excellent repeatability. This ultimately allows chipmakers to achieve the ultra-shallow junctions necessary for the production of 0.13-micron and below device generations. The 3000 also features a proprietary wafer rotation design that delivers excellent temperature uniformity. In addition, the 3000 is configured with Mattson's Ripple™ pyrometry, which allows for accurate and repeatable temperature measurement and control.

About Mattson Technology, Inc.

Mattson Technology, Inc. is a leading supplier of semiconductor wafer processing equipment used in "front-end" fabrication of integrated circuits. The company is a market leader in dry strip and RTP equipment, and its products combine advanced process technology on high-productivity platforms backed by industry-leading support. Since beginning operations in 1989, the company’s core vision has been to help bring technology leadership and productivity gains to semiconductor manufacturers worldwide. Headquartered in Fremont, Calif., the company maintains sales and support centers throughout the United States, Europe and Asia. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900. Fax: (510) 492-5911. Internet: www.mattson.com.