MATTSON TECHNOLOGY ANNOUNCES CONTINUED ORGANIZATIONAL RESTRUCTURING

FREMONT, Calif. - December 13, 2001 - Mattson Technology (NASDAQ: MTSN), a leading supplier of advanced process equipment used in the manufacture of semiconductors, today announced continuing efforts to better align the company's strategic infrastructure with customer demand during the industry's prolonged downturn. Mattson is currently implementing additional measures to reduce corporate and manufacturing overhead, in line with the plans for a 30 percent global headcount reduction, as indicated in the Company's third quarter update on November 13.

To drive down corporate overhead and improve operational and financial performance, the company will consolidate its three divisions (Plasma, Thermal and Wet) to two (Thermal, Films & Etch and Wet), while decentralizing its corporate organizational structure to a divisional reporting responsibility.

"Mattson's restructuring efforts are driven both by the challenges of the industry's extended market downturn and by the company's need to quickly integrate last year's acquisitions to achieve maximum synergies and operating performance. Our goal is to complete restructuring by the end of the year and be properly sized by the beginning of 2002," said Dave Dutton, Mattson's acting chief executive officer.

"At the same time, we are addressing market needs," Dutton continued. "We are renewing our emphasis on customer satisfaction, ensuring that our maximum efforts go to those areas of our business that are critical to our customers. We recently advanced our product offering with the Highlands, our newest strip tool, targeted at the advanced cleaning requirements of back-end applications for advanced low-k copper production lines. Customers now recognize the advantages of our 300 mm productivity and broad capabilities in the back end, and with our newest offering, we are confident we can maintain our 300 mm leadership when the industry recovers," Dutton said.

This press release contains forward looking statements regarding, among other matters, the Company's future prospects and near-term outlook, the effects of our restructuring and cost reduction programs, and customer demand and the effect of the economic downturn. Forward looking statements address matters that are subject to a number of risks and uncertainties that can cause actual results to differ materially. In addition to the general risks associated with the slowdown in the semiconductor industry and with development of complex technology, future results of the Company will depend on a variety of factors, including the timing of significant orders, the ability of the Company to timely manufacture and deliver ordered products, the ability of the Company to bring new systems to market, the timing of new product releases by the Company's competitors, other competitive factors, and risks of integration following the STEAG-CFM acquisitions. Reference is made to the Company's filings with the Securities and Exchange Commission for further discussion of risks and uncertainties regarding the Company's business.

About Mattson Technology, Inc.

Mattson Technology, Inc. is a leading supplier of semiconductor wafer processing equipment used in "front-end" fabrication of integrated circuits. The company is a market leader in dry strip and RTP equipment, and its products combine advanced process technology on high-productivity platforms backed by industry-leading support. Since beginning operations in 1989, the company’s core vision has been to help bring technology leadership and productivity gains to semiconductor manufacturers worldwide. Headquartered in Fremont, Calif., the company maintains sales and support centers throughout the United States, Europe and Asia. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900. Fax: (510) 492-5911. Internet: www.mattson.com.