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Press Releases - 2001

MATTSON TECHNOLOGY, STEAG SEMICONDUCTOR AND CFM MERGER COMPLETED

FREMONT, Calif. -January 2, 2001- Mattson Technology, Inc. (Nasdaq: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced the successful completion to the merger between Mattson Technology, the semiconductor equipment division of STEAG Electronic Systems AG, and CFM Technologies, Inc.

The merged company, with pro forma 2000 revenues in excess of $500 million, now employs more than 1800 people worldwide. This revenue figure makes Mattson Technology the 14th largest semiconductor manufacturing equipment supplier, with industry-leading products and technologies in multiple product lines. Already the world leader in dry strip process equipment, the addition of STEAG's RTP product line places Mattson in second position in RTP, while the combination of CFM and STEAG's wet technology tools puts the company within the top five providers of wet processing equipment.

"The key to survival in the semiconductor equipment market is to become a leader in a number of product areas and achieve enough critical mass so that customers feel comfortable about the company's ability to survive market downturns and technology changes," noted Brad Mattson, Mattson Technology's CEO. "We now can offer thermal, plasma and wet solutions on several different platforms, maximizing specific aspects of each process. Since all three companies had strong 300 mm programs, Mattson will be well positioned to become a leader in the 300 mm market."

As a result of the transactions, each share of CFM stock outstanding at the close of business on December 29, 2000 has been converted into 0.5223 shares of common stock of Mattson. Former CFM shareholders will be receiving shortly a transmittal letter and instructions for exchanging their share certificates.

This Press Release contains forward-looking statements regarding, among other matters, the Company's future performance, technology and market position. Forward looking statements address matters that are subject to a number of risks and uncertainties. In addition to the general risks associated with the development of complex technology, future results of the Company will depend on a variety of factors, including the timing of significant orders, the ability of the Company to bring new systems to market, the timing of new product releases by the Company's competitors, slowdowns in the semiconductor industry, other competitive factors, and risks of integration after the recent acquisitions. Reference is made to the Company's filings with the Securities and Exchange Commission for further discussion of risks and uncertainties regarding the Company's business.

About Mattson Technology, Inc.

Mattson Technology, Inc. is a leading supplier of semiconductor wafer processing equipment used in "front-end" fabrication of integrated circuits. The company is a market leader in dry strip and RTP equipment, and its products combine advanced process technology on high-productivity platforms backed by industry-leading support. Since beginning operations in 1989, the company’s core vision has been to help bring technology leadership and productivity gains to semiconductor manufacturers worldwide. Headquartered in Fremont, Calif., the company maintains sales and support centers throughout the United States, Europe and Asia. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900. Fax: (510) 492-5911. Internet: www.mattson.com.


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