MATTSON TECHNOLOGY RECEIVES MULTIMILLION DOLLAR ORDER FOR HIGH THROUGHPUT CVD SYSTEMS

New 200/300mm CVD System Provides Bridge Tool Capability

Fremont, Calif. — January 17, 2000 — Mattson Technology, Inc. (Nasdaq: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, today announced that it has received an order exceeding $9 million dollars from a major DRAM manufacturer for multiple Aspen III CVD systems, plasma enhanced chemical vapor deposition equipment. Built on Mattson's unique Aspen III platform, the system offers the industry's highest throughput for thin film applications. The high throughput, combined with Mattson's three-year all-inclusive warranty, provides a cost of ownership advantage over competitive CVD systems. Since its market introduction in first quarter, 1999, the Aspen III CVD system has quickly gained market acceptance with the receipt of multiple orders in 1999. The systems are scheduled to be shipped in the second quarter, 2000.

The 200/300mm bridge tool can use the same chamber to process either 200mm or 300mm wafers. Mattson Technology continues to work closely with key customers in Japan, North America and Europe to ease the transition from 200mm to 300mm wafer processing. The company has more than 20 Aspen III tools installed at leading-edge semiconductor facilities around the world, running both 200mm and 300mm processes in production.

"We are continuing our aggressive launch of the new Aspen III CVD. These orders are a major achievement for a new product in a competitive market like CVD, " said Brad Mattson, CEO of Mattson Technology. "By designing the Aspen III CVD to use the same process chamber for both 200mm and 300mm processing, we will be able to prove the system's capabilities in production before the changeover to 300mm manufacturing occurs," he added.

The Aspen III CVD system deposits silane-based films such as oxide, oxynitride and nitride, as well as TEOS-based (tetraethylorthosilicate) oxide films. Mattson offers a full suite of PE CVD applications: ARC layers for excellent CD control; etch stop layers for use with low k materials; passivation layers; IMD underlayers, low temperature capping layers; and low k FSG layers. Depending on the type of film deposited, the Aspen III CVD has the capability to process up to 180 wafers per hour - a higher throughput than the original Aspen II CVD system, which set new industry standards when it was introduced in 1994.

BRIDGING THE GAP BETWEEN 200MM & 300MM MANUFACTURING

The Aspen III CVD system is the first true CVD bridge system in the industry. While other 300mm systems may require new process chambers to convert to 200mm, the Aspen III CVD can be converted to either 200mm or 300mm manufacturing with only a few minor modifications to the cassette or FOUP stations. The flexible system design addresses the needs of large volume manufacturing where cost is a major consideration. Aspen III CVD has the smallest footprint available in 200 and 300 mm PECVD tools and provides up to a 50 percent throughput advantage for selected thin film applications.

About Mattson Technology

Mattson Technology Inc., is a leading supplier of thermal, plasma and wet semiconductor processing equipment. The company's products combine advanced process technology on a high productivity platform, backed by industry-leading support. Since beginning operations in 1989, the company's core vision has been to help bring technology leadership and productivity gains to semiconductor manufacturers worldwide. Headquartered in Fremont, Calif., the company maintains sales and support centers throughout the United States, Europe, Asia/Pacific and Japan. For more information, please contact Mattson Technology Inc., 2800 Bayview Drive, Fremont, Calif. 94538. Telephone: (800) MATTSON. Fax: (510) 657-0165. Internet:www.mattson.com